In this special guest feature, Robert Roe from Scientific Computing World writes that increasingly power-hungry and high-density processors are driving the growth of liquid and immersion cooling technology. “We know that CPUs and GPUs are going to get denser and we have developed technologies that are available today which support a 500-watt chip the size of a V100 and we are working on the development of boiling enhancements that would allow us to go beyond that.”
The Use of High-Performance Polymers in HPC and Data Center Applications
November 15, 2019 by
“Polymer components in liquid cooling systems are attractive for several reasons: they are lightweight, typically less expensive than metal counterparts, and are impervious to corrosion that can render parts inoperable or introduce debris into flow paths. The challenges with many polymers used to date, however, are their abilities to handle high temperatures and physical stressors without deforming, cracking or creeping. These shortcomings become significant when leaks occur, leading to downtime or damage to equipment.”
The Use of High-Performance Polymers in HPC and Data Center Applications
November 13, 2019 by Leave a Comment
This whitepaper from CPC details the use of high-performance polymers in HPC and data center applications where plastics advance as a viable, reliable option in liquid cooling systems. CPC offers the industry’s first PPSU QD, purpose-built for liquid cooling use in HPC and data centers.
Thermoplastic Connectors Grow in Popularity Along with Liquid Cooling
September 7, 2019 by
As liquid cooling becomes more and more prevalent, new technology and types of connectors are becoming water cooler topics for those in the data and computing industries. According to a new report from CPC, long-term, leak-free performance in fluid management systems requires robust connectors. And advanced materials are growing the range of available QD options.
Metal or Plastic Quick Disconnects? Key Considerations
September 3, 2019 by Leave a Comment
Long-term, leak-free performance in fluid management systems requires robust connectors. As liquid cooling is increasingly deployed in high performance computing and data center applications, these industries demand quick disconnects (QDs) purpose-built for their needs. Gone are the days of making do with metal ball-and-sleeve connectors designed for heavy industrial use. Download the new guide from CPC that outlines key performance factors of new PPSU QDs compared to traditional all-metal QDs for liquid cooling.
Metal or Plastic Liquid Cooling Connectors? What You Should Consider
January 17, 2019 by
With recent advances, high-performance thermoplastic now offers performance that rivals, and in some cases, surpasses their metal counterparts. Design engineers have to take several factors into consideration when trying to choose between metal or plastic quick disconnects. This guest article from CPC takes a look at the differences between metal and plastic liquid cooling connectors, and the benefits and challenges to each.
New CPC QD Solution Optimizes HPC Liquid Cooling
December 3, 2018 by
In this video from SC18, Kristin Anderson from CPC describes the company’s innovative connector couplings for liquid cooling. “PLQ Series QDs are among the highest-performing engineered polymer connectors for liquid cooling applications available. They vastly reduce concerns around plastic QD durability and performance,” said Elizabeth Langer, Senior Design Engineer, Thermal Management. “HPC and data center specifiers and operators can use these plastic QDs with confidence.”
The Right Terminations for Reliable Liquid Cooling in HPC
November 19, 2018 by
High performance computing manufacturers are increasingly deploying liquid cooling. To avoid damage to electronic equipment due to leaks, secure drip-free connections are essential. Quick disconnects for HPC applications simplify connector selection. And with expensive electronics at stake, understanding the components in liquid cooling systems is critical. This article details what to look for when seeking the optimal termination for connectors—a way to help ensure leak-free performance.
CPC to Showcase New QD Connectors for HPC Liquid Cooling at SC18
November 9, 2018 by
Today CPC (Colder Products Company) introduced its new PLQ2 high-performance thermoplastic connector. “PLQ Series QDs are among the highest-performing engineered polymer connectors for liquid cooling applications available. They vastly reduce concerns around plastic QD durability and performance,” said Elizabeth Langer, senior design engineer, thermal management. “HPC and data center specifiers and operators can use these plastic QDs with confidence.”
The Right Terminations for Reliable Liquid Cooling in HPC
September 17, 2018 by
Liquid cooling for HPCs is increasingly common. With expensive electronics at stake, understanding the components in liquid cooling systems is critical. This article details what to look for when seeking the optimal termination for connectors—a way to help ensure leak-free performance.
