Qumulo Announces AI Infrastructure Benchmark Results with Azure Native Qumulo

SEATTLE – June 3rd, 2024 – Today, data storage and management company Qumulo said it achieved the industry’s fastest and most cost-effective cloud-native storage solution, as demonstrated by the latest SPECstorage Solution 2020 AI_IMAGE Benchmark results. Qumulo’s Azure Native Qumulo (ANQ) achieved an Overall Response Time (ORT) of 0.84ms with a total customer cost of […]

Pinecone Names Lauren Nemeth COO and Bob Muglia as Board Member 

NEW YORK, June 3, 2024 – Vector database AI company Pinecone today announced that Lauren Nemeth and Bob Muglia have joined the company as chief operating officer (COO) and board member, respectively. This comes as Pinecone celebrates its five-year anniversary and the GA of its flagship offering, Pinecone serverless, a vector database designed to make […]

‘Microjet Impingement’ Liquid Cooling Advances as AI Heat Rises

Single-phase direct-to-chip liquid cooling, particularly effective with “microjet impingement,” targets coolant directly at the hottest chip parts, managing high heat loads while boosting silicon performance. This method, which can cool chips over 2,000W ….

CEA-Leti Reports 3-Layer Integration, Progress toward AI-Embedded CMOS Image Sensors

DENVER – May 31, 2024 – CEA-Leti scientists have reported three projects at ECTC 2024 that they say are steps to enabling CMOS image sensors (CIS) that can exploit image data to perceive a scene, understand the situation and intervene in it – capabilities that require embedding AI in the sensor. Demand for smart sensors is […]

Eviden’s Center for Excellence in Performance Programming (CEPP) – Accelerate Workloads, Add Value to Simulation!

[SPONSORED GUEST WHITE PAPER]   This white paper spotlights Eviden’s Center for Excellence in Performance Programming (CEPP), which empowers organizations to ….

Lenovo and Cisco Announce AI Partnership

May 30, 2024 – Lenovo and Cisco today unveiled a partnership intended to deliver fully integrated infrastructure and networking solutions designed to accelerate digital transformation for businesses of all sizes. The two companies have signed a Memorandum of Understanding (MoU) agreement to jointly establish design, engineering, and execution plans for accelerating digital transformation with turnkey […]

Quantum: Photonic Demonstrates Distributed Entanglement between Modules

VANCOUVER, BC, May 30, 2024—Photonic Inc., a distributed quantum computing in silicon company, today announced what the company said is a milestone on the path to commercial quantum systems. While many existing quantum architectures achieve entanglement within modules, Photonic has demonstrated entanglement between modules. In this way, Photonic’s architecture provides a unique solution to one […]

Eviden to Deliver Supercomputer for University of Reims Champagne-Ardenne

Paris – May 30, 2024 – Eviden today announces that it has been selected by the University of Reims Champagne-Ardenne (URCA) to supply the university with a new supercomputer for its Regional Computing Center ROMEO ….

Ultra Accelerator Link Group for Data Center AI Connectivity Formed: AMD, Broadcom, Cisco, Google, HPE, Intel, Meta and Microsoft

BEAVERTON, Ore.– AMD, Broadcom, Cisco, Google, Hewlett Packard Enterprise (HPE), Intel, Meta and Microsoft today announced they have aligned to develop a new industry standard dedicated to advancing high-speed and low latency communication for scale-up AI systems linking in data centers. Called the Ultra Accelerator Link (UALink), this initial group will define and establish an […]

Report: New ASML Machines Could Produce Denser, Cheaper Advanced Chips

ASML, whose chip manufacturing machines produce advanced microprocessors used for HPC and AI, says it has set a new chipmaking density record with its new High-NA machine, breaking the previous record set ….