London, 04 April, 2024: Liquid cooling technology company Iceotope Technologies announced that Christian Belady has been named senior advisor to the company. Iceotope said Belady is an established data center executive known for his innovative approaches to infrastructure and quantitative benchmarking. The appointment coincides with increasing global demand for Iceotope solutions and an ambitious global […]
Iceotope Teams with HPE, Intel and nVent on Liquid Cooled Open RAN for the Edge
Barcelona, February 27, 2023 — Liquid cooling company Iceotope has announced what it said is a highly efficient and scalable Open RAN solution to support far edge computing across telco data center estates. Created with demanding workloads in mind, Ku:l Extreme is designed to be an integrated, standardized solution that offers sustainability, energy efficiency and […]
Rapid Growth lands Iceotope on 2019 Deloitte Fast 50
Today datacenter cooling vendor Iceotope announced that it ranked number 14 and were Midlands Regional Winners in the 2019 Deloitte UK Technology Fast 50, a ranking of the 50 fastest-growing technology companies in the UK. Rankings are based on percentage revenue growth over the last four years. Iceotope grew 2,331% during this period.
ExaNeSt Project Successfully Builds Prototype for Exascale
In this video, researchers describe the results from the ExaNeSt project. “The prototype is now successfully built, demonstrating energy efficiency in a High-Performance Computing (HPC) testbed: the energy consumed for solving a given problem on this new platform is 3 to 10 times lower than what traditional HPC processors of the same time generation consume for solving the same problem. The substantial prototype has been validated through the execution of full HPC applications from materials science, climate forecasting, computational fluid dynamics, astrophysics, neuroscience, and a database.”
Video: Building Computing and Data Centres for Exascale in the EU
In this video from the 2018 Swiss HPC Conference, Peter Hopton from the EuroEXA project shares the problems and the solutions that are being developed in the EuroEXA co-design project. “EuroEXA hardware designers work together with system software experts optimizing the entire stack from language runtimes to low-level kernel drivers, and application developers that bring in a rich mix of key HPC applications from across climate/weather, physical/energy and life-science/bioinformatics domains to enable efficient system co-design and maximize the impact of the project.”
Preliminary Agenda Posted for HPC Advisory Council Swiss Conference
The HPC Advisory Council has posted their meeting agenda for their Swiss Conference. Held in conjunction with HPCXXL, the event takes place April 9-12 in Lugano, Switzerland. “Delve into a wide range of interests, disciplines and topics in HPC – from present day application to its future potential. Join the Centro Svizzero di Calcolo Scientifico (CSCS), HPC Advisory Council members and colleagues from around the world for invited and contributed talks and immersive tutorials at the ninth annual Swiss Conference! Knowledgeable evaluations, prescriptive best practices and provocative insights, the open forum conference brings together industry experts for three days of highly interactive sessions.”
Announcing the EuroEXA Project for Exascale
Today, 16 organizations met at the Barcelona Supercomputer Centre to mark the start of the EuroEXA project and the commencement of the execution in the next stage of EU investment towards realizing Exa-Scale computing in Europe. “In EuroEXA, we have taken a holistic approach to break-down the inefficiencies of the historic abstractions and bring significant innovation and co-design across the entire computing stack.”
What Lies Ahead for HPC Cooling?
“To meet the ambitious targets for exascale computing, many cooling companies are exploring optimizations and innovative methods that will redefine cooling architectures for the next generation of HPC systems. Here, some of the prominent cooling technology providers give their views on the current state and future prospects of cooling technology in HPC.”