CHIPS and Science Act Archives - High-Performance Computing News Analysis | insideHPC https://insidehpc.com/tag/chips-and-science-act/ At the Convergence of HPC, AI and Quantum Mon, 10 Jun 2024 17:40:32 +0000 en-US hourly 1 https://wordpress.org/?v=6.5.3 57143778 HPC News Bytes 20240610: Clinical Trials for HPC-Discovered Drug, New Liquid Cooling Technique, CHIPS Act Update, Low Memory-Low Power AI https://insidehpc.com/2024/06/hpc-news-bytes-20240610-clinical-trials-for-hpc-discovered-drug-new-liquid-cooling-technique-chips-act-update-low-memory-low-power-ai/ https://insidehpc.com/2024/06/hpc-news-bytes-20240610-clinical-trials-for-hpc-discovered-drug-new-liquid-cooling-technique-chips-act-update-low-memory-low-power-ai/#respond Mon, 10 Jun 2024 14:38:54 +0000 https://insidehpc.com/?p=94211

Good June morning! It’s been an interesting week in HPC-AI, here’s a quick (6:53) review of the latest news and trends: Clinical trials for cancer fighting drug discovered ....

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TSMC in the USA: Up to $6.6B in CHIPS Act Funding for 3rd (2nm or More) Arizona Fab https://insidehpc.com/2024/04/tsmc-in-the-usa-up-to-6-6b-in-chips-act-funding-for-3rd-2nm-or-more-arizona-fab/ Tue, 09 Apr 2024 13:50:30 +0000 https://insidehpc.com/?p=93800

TSMC announced it has signed a preliminary agreement with the U.S. Dept. of Commerce for up to $6.6 billion under the CHIPS and Science Act. TSMC also announced plans to build a third fab at its TSMC Arizona site in  Phoenix using 2nm or more processes....

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DOD Announces $238M CHIPS and Science Act Awards for Microelectronics Hubs https://insidehpc.com/2023/09/dod-announces-238m-chips-and-science-act-awards-for-microelectronics-hubs/ Wed, 20 Sep 2023 21:18:48 +0000 https://insidehpc.com/?p=92396

The U.S. Department of Defense today announced the award of $238 million in CHIPS and Science Act funding for eight Microelectronics Commons regional innovation hubs. This is the largest award to date under the act, which was passed in August 2022 and provides roughly $280 billion for research and manufacturing of semiconductors in the United States.

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insideHPC-Hyperion Research Interview: Argonne’s Rick Stevens on the Future of Everything – U.S. Post-Exascale Strategy, AI for Science, HPC in 2040 and an Aurora Install Update https://insidehpc.com/2023/03/insidehpc-hyperion-research-interview-argonnes-rick-stevens-on-the-future-of-everything-u-s-post-exascale-strategy-ai-for-science-hpc-in-2040-and-an-aurora-install-update/ Fri, 24 Mar 2023 18:24:27 +0000 https://insidehpc.com/?p=91248

In this interview conducted on behalf of HPC analyst firm Hyperion Research, we spoke with Argonne National Laboratory’s Rick Stevens about the present and future of HPC. The starting point for this conversation is a presentation Stevens gave at a Hyperion event in Washington related to implementation of the CHIPS and Science Act and includes his insights on the post-exascale build-out of an integrated network of U.S. supercomputing capacity (the Integrated Research Infrastructure, or IRI). We then look at AI for science and the use of data-driven modeling and simulation, which shows the potential to deliver major performance gains for researchers....

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inside HPC-Hyperion Research Interview: NSF’s Manish Parashar on the CHIPS and Science Act https://insidehpc.com/2023/03/inside-hpc-hyperion-research-interview-nsfs-manish-parashar-on-the-chips-and-science-act/ Wed, 08 Mar 2023 19:29:46 +0000 https://insidehpc.com/?p=91133

As part of insideHPC's series of interviews on behalf of HPC analyst firm Hyperion Research, we spoke with Manish Parashar, National Science Foundation director of the Office of Advanced Cyberinfrastructure (OAC). Our topic: the NSF's role in the implementation of the CHIPS and Science Act, the $280 billion bill enacted last year by the U.S. government to boost domestic research and manufacturing of semiconductors. This interview is based on a presentation Parashar gave at a special Hyperion event recently held in Washington. Highlights include....

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DOE and NSF to Expand Collaboration https://insidehpc.com/2023/01/doe-and-nsf-to-expand-collaboration/ Wed, 25 Jan 2023 22:18:41 +0000 https://insidehpc.com/?p=90904 Jan. 25, 2023 — Today the U.S. Department of Energy (DOE) and the National Science Foundation (NSF) signed a Memorandum of Understanding (MOU) that will continue a longstanding collaboration on scientific and engineering research and enable increased partnership. “This MOU will allow us to strengthen the partnership between DOE and NSF. It will expand the capabilities of each […]

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