Seoul, April 19, 2024 – Memory company SK hynix Inc. announced today a memorandum of understanding with TSMC to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family, slated to be mass produced […]
SK hynix to Invest $3.9B in Indiana HBM Fab and R&D with Purdue
April 3, 2024 by
Memory chip company SK hynix announced it will invest $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products. The project, which the company said is the first of its kind in the U.S., will be an advanced….
SK hynix Says It Has Developed First 12-Layer HBM3
April 20, 2023 by
Seoul, April 20, 2023 – SK hynix Inc. announced today it has become the industry’s first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers’ performance evaluation of samples is underway. HBM (High Bandwidth Memory) is a high-performance memory that vertically interconnects multiple […]
Intel Optane Persistent Memory Tops IO500 List
August 11, 2020 by
Intel announced today that its Optane persistent memory (PMem), in combination with Intel’s open-source distributed asynchronous object storage (DAOS) solution, has taken the no. 1 position on the Virtual Institute for I/O IO500 list for file system performance. Intel said DAOS, with 30 servers of Intel Optane PMem, came in ahead of systems on the […]
