Here's a sprint (5:16) through the latest HPC -AI news, including: NVIDIA's big feature story in The New Yorker, the Open Benchmark Council's TOP100 lists, Intel and TSMC's high-end 3 nanometer fab, digital twins for hydropower at ORNL and PNNL.

The post HPC News Bytes 20231204: The New Yorker on NVIDIA, the Open Benchmark Council, Intel and TSMC, Digital Twins for Hydropower appeared first on High-Performance Computing News Analysis | insideHPC.

A happy mid-October morning to you! Today’s HPC News Bytes podcast offers a rapid (5:08) romp through recent HPC developments, including: China's goal of 300 exaflops in 2025; Samsung's 3nm chip win; Exascale Day; fewer women computer scientists since 1984; the GPU competition between NVIDIA, AMD and Intel....

The post HPC News Bytes 20231016: China and 300eFLOPS, Samsung’s 3nm Order, Exascale Day, Women and Coding, the Coming GPU Battle appeared first on High-Performance Computing News Analysis | insideHPC.

A news story in the Korean news publication Pulse reported today that Samsung electronics has confirmed "a new order for 3-nanometer high performance server chips." The Pulse story stated that semiconductor designer ADTechnology Co., a Korea-based design solution partner of Samsung and member of the AADP (Arm Approved....

The post Report: Samsung Secures Order for 3nm Server Chips for US Company ‘Involved in HPC’ appeared first on High-Performance Computing News Analysis | insideHPC.

HSINCHU, Taiwan, R.O.C. – TSMC (TWSE: 2330, NYSE: TSM) held a 3 nanometer (3nm) volume production and capacity expansion ceremony on December 29 at its Fab 18 construction site in the Southern Taiwan Science Park (STSP), bringing together suppliers, construction partners, central and local government, the Taiwan Semiconductor Industry Association, and member of academia to witness an […]

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(Editor's Note: This story, originally published on Dec. 5, was updated on Dec. 6.) Pointing to high costs and a US skills shortage, Taiwanese chip manufacturer TSMC has reported challenges to the completion by next December of its new 4 nanometer semiconductor plant north of Phoenix, according to a story in The Wall Street Journal on Dec. 5. “The $12 billion Arizona semiconductor plant under construction that President Biden is visiting Tuesday represents U.S. hopes for a renaissance in manufacturing, but the Taiwanese company building it says it won’t be easy,” the Journal article stated. “High costs, lack of trained personnel and unexpected construction snags are among the issues cited by Taiwan Semiconductor Manufacturing Co.  as it rushes to get the north Phoenix factory ready to start production in December 2023.”

The post TSMC’s $40B US Investment: 4nm Fab Hitting Snags, 3nm Plant Construction Has Begun appeared first on High-Performance Computing News Analysis | insideHPC.

In this exclusive interview, conducted on behalf of HPC industry analyst firm Hyperion Research, we talk with Yujun Li, director of HPC business development for the Taiwan Semiconductor Manufacturing Company (TSMC), one of the most advanced chip manufacturers in the world, whose customers include AMD, NVIDIA – and Intel. Li amplifies TSMC’s public statements that HPC is the company’s fastest growing market segment, discusses TSMC’s HPC chip strategies and fab expansion and its 5 nanometer and 3nm plans.

The post inside HPC-Hyperion Research Interview: TSMC Explains Why HPC Is Its Fastest Growing Market, the Path to 3nm Chips and What’s Coming up from the Company appeared first on High-Performance Computing News Analysis | insideHPC.