Samsung Electronics Archives - High-Performance Computing News Analysis | insideHPC https://insidehpc.com/tag/samsung-electronics/ At the Convergence of HPC, AI and Quantum Tue, 20 Feb 2024 14:11:39 +0000 en-US hourly 1 https://wordpress.org/?v=6.5.3 57143778 Samsung Collaborates with Arm on Cortex-X CPU https://insidehpc.com/2024/02/samsung-collaborates-with-arm-on-cortex-x-cpu/ Tue, 20 Feb 2024 14:11:28 +0000 https://insidehpc.com/?p=93486

SAN JOSE, Feb 20, 2024 – Samsung Electronics Co., Ltd. today announced a collaboration to deliver Arm Cortex-X CPU developed on Samsung Foundry’s Gate-All-Around (GAA) process technology. This initiative is built on a partnership with devices shipped with Arm CPU intellectual property on various process nodes offered by Samsung Foundry. This collaboration will lead to […]

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Report: Samsung Secures Order for 3nm Server Chips for US Company ‘Involved in HPC’ https://insidehpc.com/2023/10/report-samsung-secures-order-for-3nm-server-chips-for-us-company-involved-in-hpc/ Wed, 11 Oct 2023 20:12:50 +0000 https://insidehpc.com/?p=92614

A news story in the Korean news publication Pulse reported today that Samsung electronics has confirmed "a new order for 3-nanometer high performance server chips." The Pulse story stated that semiconductor designer ADTechnology Co., a Korea-based design solution partner of Samsung and member of the AADP (Arm Approved....

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Samsung Announces 12nm-Class 32Gb DDR5 DRAM  https://insidehpc.com/2023/08/samsung-announces-12nm-class-32gb-ddr5-dram/ Wed, 30 Aug 2023 18:08:09 +0000 https://insidehpc.com/?p=92255

SEOUL, Korea – Sept. 1, 2023 – Samsung Electronics today said it has developed the industry's first 32-gigabit (Gb) DDR5 DRAM using 12 nanometer (nm)-class process technology. This comes after Samsung began mass production of its 12nm-class 16Gb DDR5 DRAM in May 2023.

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Samsung and Western Digital Form Zoned (Block) Storage Collaboration https://insidehpc.com/2022/03/samsung-and-western-digital-form-zoned-block-storage-collaboration/ Wed, 30 Mar 2022 00:00:33 +0000 https://insidehpc.com/?p=89361 Samsung Electronics and Western Digital today announced a collaboration around zoned storage, which is a form of block storage, focused on data placement, processing and fabrics (D2PF) technologies. Western Digital has said zone storage is designed for workloads with increasingly voluminous and complex data management needs, creating “block storage devices that have their address space […]

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