SEOUL, Korea – Sept. 1, 2023 – Samsung Electronics today said it has developed the industry’s first 32-gigabit (Gb) DDR5 DRAM using 12 nanometer (nm)-class process technology. This comes after Samsung began mass production of its 12nm-class 16Gb DDR5 DRAM in May 2023.
Micron Launches Memory Expansion Module Portfolio for CXL 2.0 Adoption
BOISE, Idaho, Aug. 07, 2023 — Micron Technology, Inc. (Nasdaq: MU), today announced sample availability of the Micron CZ120 memory expansion modules to customers and partners. The Micron CZ120 modules come in 128GB and 256GB capacities in the E3.S 2T form factor, which uses PCIe Gen5 x8 interface. Additionally, the CZ120 modules are capable of […]
Micron to Bring EUV Technology for Memory Manufacturing to Japan
HIROSHIMA, Japan, May 17, 2023 — Micron Technology, Inc. (Nasdaq: MU) announced today it will introduce extreme ultraviolet (EUV) technology to Japan, bringing patterning technology to manufacture its next generation of DRAM, the 1-gamma (1γ) node. Micron said it will be the first semiconductor company to bring EUV technology to Japan, at its Hiroshima fab. […]
Argonne Researchers: Tiny Magnetic ‘Whirlpools’ Could Be Game Changer for HPC Memory Technology
Scientists at the U.S. Department of Energy’s (DOE) Argonne National Laboratory are investigating the possibility that tiny magnetic whirlpools called “skyrmions,” which are magnetic vortices as tiny as billionths of a meter, could transform memory storage in future high performance computers. Skyrmions, the Argonne researchers say, show characteristics that could overcome the shortcomings of microscopic […]
Micron: DDR5 Server DRAM Now Available
BOISE, Idaho, July 06, 2022 — Memory and storage company Micron Technology, Inc. (Nasdaq: MU), today announced the availability of Micron DDR5 server DRAM in support of industry qualification of next-generation Intel and AMD DDR5 server and workstation platforms. Micron said the move to DDR5 memory enables up to an 85 percent increase in system […]
SK hynix to Supply HBM3 DRAM to NVIDIA
Seoul, June 9, 2022 – SK hynix announced that it began mass production of HBM3, high-performance memory that vertically interconnects multiple DRAM chips “and dramatically increases data processing speed in comparison to traditional DRAM products,” the company said. HBM3 DRAM is the 4th generation HBM product, succeeding HBM (1st generation), HBM2 (2nd generation) and HBM2E […]