A happy end-of-March morning to you! Here’s a rapid (5:57) run-though of the latest news in HPC-AI, including: final reflections on Nvidia GTC 2024, Intel to receive $8.5 billion via US CHIPS Act, the expanding Ultra Ethernet Consortium, Samsung’s upcoming GPU/HBM blend.
HPC News Bytes 20240325: Final GTC Thoughts, Intel and CHIPS Act Largesse, Ultra Ethernet Consortium Expands, Samsung’s GPU/HBM Chip
March 25, 2024 by
HPC News Bytes 20240304: GPU Scarcity, Global Fab Capacity Boost, AI Hurdles and Singapore’s AI Training Strategy (Including Mid-Careerists)
March 4, 2024 by
A good March morning to you! Forthwith is a fast (5:51) run-though of recent HPC-AI news, including: The GPU shortage; HPE, Dell financial results, GPU allocations, new Intel fabs….
AI Robotics Startup Attracting $675M from Nvidia, OpenAI, Microsoft, Bezos
March 1, 2024 by
Start up robotics company Figure, founded in 2022 and based in Sunnyvale, CA, is in the process of attracting $675 million in venture funding from the likes of Amazon founder Jeff Bezos, Microsoft, Intel, Samsung, OpenAI and Nvidia, along with a slew….
Dawn Rising: UK’s Top AI Supercomputer Begins Operations at Univ. of Cambridge
February 26, 2024 by
The UK’s most powerful AI supercomputer, an Intel-Dell system called Dawn (Phase 1, pictured here), is up and running at a University of Cambridge data center. The system is powered by more than 1,000 Intel Data Center GPU Max Series chips and more….
Charles Wuischpard Names Nvidia VP North America Latin America Sales
February 23, 2024 by
HPC industry veteran Charles Wuischpard, formerly of Intel and silicon photonics startup Ayar Labs, announced recently on his LinkedIn page that he has joined Nvidia as vice president of North America Latin America (NALA) sales. In December, Wuischpard ended his tenure as Ayar Lab’s CEO, a position he held starting in 2018. Previously, at Intel […]
Cadence and Intel Foundry Partner on EMIB Packaging for Heterogeneous Integration
February 21, 2024 by
Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the complexity in heterogeneously integrated multi-chip(let) architectures, the companies announced. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI […]
Ohio Supercomputer Center Announces ‘Cardinal’ HPC Cluster, Doubles AI Processing
February 20, 2024 by
The Ohio Supercomputer Center today announced “Cardinal,” an HPC cluster (test node is pictured here) that the center said doubles its AI processing capacity. The system is scheduled to be launched in the second half of this year. A collaboration including Intel, Dell Technologies, Nvidia….
HPC News Bytes 20240212: Honda Taps Cadence CFD HPC, Chip Industry Gyrations, Yelick in ISC Spotlight
February 12, 2024 by
Good day-after-Super-Bowl morning to you! It was an interesting week in HPC-AI last week, here’s a quick (5:47) run through some of the latest goings on: Honda taps Cadence supercomputer for air taxi R&D, chip industry gyrations, Kathy Yelick to deliver ISC 2024 keynote, Google settles patent infringement case….
Trillions for Chips: A Roiled Semiconductor Industry Strains to Meet AI Demand
February 9, 2024 by
We’re seeing the chip industry’s version of the scientific aphorism: “nature hates a vacuum.” The vacuum is the short supply of – and vast demand for – AI chips, and it’s roiling the semiconductor industry. Chip foundry companies TSMC, Intel and Samsung are straining to expand GPU fab capacity….
HPC News Bytes: Eni’s Monster HPE Supercomputer, Intel’s New Mexico Fab, NSF’s AI Research Resource, D-Wave and IonQ Quantum Advancements
January 29, 2024 by
A good January morning to you! It was an interesting week in HPC-AI, here’s a rapid (6:07) rundown of the latest doings, including: Italy energy giant Eni’s 600 PFLOPS HPE supercomputer, Intel opens….
