Special guest and last year's ISC program chair John Shalf joins Shahin and Doug in this episode of the @HPCpodcast, sponsored by Lenovo, to discuss the rise of specialized architectures to boost HPC performance in the post-Moore's Law era. It's a topic ....

The post @HPCpodcast: John Shalf on the ‘Attack of the Killer Chiplets’ and the Future of HPC appeared first on High-Performance Computing News Analysis | insideHPC.

Overarching both themes is the slowing of Moore’s Law, the deceleration of improvement in HPC performance combined with increasing costs for new generations of systems. In addition, implementing and realizing the benefits of new systems is slowing ....

The post ISC 2024’s Wednesday Keynote: Two Trends Transforming HPC appeared first on High-Performance Computing News Analysis | insideHPC.

We’re seeing the chip industry’s version of the scientific aphorism: “nature hates a vacuum.” The vacuum is the short supply of – and vast demand for – AI chips, and it’s roiling the semiconductor industry. Chip foundry companies TSMC, Intel and Samsung are straining to expand GPU fab capacity....

The post Trillions for Chips: A Roiled Semiconductor Industry Strains to Meet AI Demand appeared first on High-Performance Computing News Analysis | insideHPC.

A good January morning to you! It was an interesting week in HPC-AI, here’s a rapid (6:07) rundown of the latest doings, including: Italy energy giant Eni's 600 PFLOPS HPE supercomputer, Intel opens....

The post HPC News Bytes: Eni’s Monster HPE Supercomputer, Intel’s New Mexico Fab, NSF’s AI Research Resource, D-Wave and IonQ Quantum Advancements appeared first on High-Performance Computing News Analysis | insideHPC.

Gearing up for what it intends to be a multi-horse race in the exploding AI chip sector, Intel today announced a next-generation Xeon enterprise and data center CPU built with AI inferencing in mind, along with mobile processors targeting “AI PC,” and an advance look from Intel CEO....

The post Intel Announces AI-Oriented 5th Gen Xeon, Provides Gaudi3 GPU Accelerator Sneak Peak appeared first on High-Performance Computing News Analysis | insideHPC.

A happy deep and dark December morning to you! Here's a sprint (5:28) through recent HPC-AI news, including: AMD MI300, the Q2B quantum conference and other quantum news, the Linux Foundation's new projects....

The post HPC News Bytes 20231211: AMD’s MI300, Quantum in the News, Linux Foundation’s 2 New Projects, EU AI Regulations, ISC Extends Deadlines appeared first on High-Performance Computing News Analysis | insideHPC.

After years of NVIDIA having its dominant way in the GPU AI chip market -- a market that has exploded over the last 12 months with the emergence of generative AI -- AMD today announced the availability of the long-awaited and much previewed MI300X accelerator chip (pictured here) that AMD intends to be a worthy competitor with NVIDIA's H100....

The post Taking on NVIDIA: AMD Announces Availability of MI300 GPU Accelerators appeared first on High-Performance Computing News Analysis | insideHPC.

Here's a sprint (5:16) through the latest HPC -AI news, including: NVIDIA's big feature story in The New Yorker, the Open Benchmark Council's TOP100 lists, Intel and TSMC's high-end 3 nanometer fab, digital twins for hydropower at ORNL and PNNL.

The post HPC News Bytes 20231204: The New Yorker on NVIDIA, the Open Benchmark Council, Intel and TSMC, Digital Twins for Hydropower appeared first on High-Performance Computing News Analysis | insideHPC.

By Adrian Cockcroft, Partner & Analyst, OrionX Last year the UCIe chiplet standard had just been launched, and since then just about everyone has joined it, about 130 companies. The idea is that to build a complete CPU or GPU you don’t have to put it all on the same chip from the same....

The post SC23: TOP500 Trends, the AI-HPC Crossover, Chiplet Standardization, the Emergence of UCIe and CXL Advancements appeared first on High-Performance Computing News Analysis | insideHPC.

[SPONSORED GUEST INTERIVEW] We spoke at the Lenovo booth with Andreas Thomasch, Director of HPC and AI, European Markets, in this sponsored interview about recent developments across critical HPC-AI challenge areas: Water Cooling: Lenovo was an....

The post At SC23: Lenovo’s Advancements in Liquid Cooling, Storage, Digital Twins and HPC-AI Software appeared first on High-Performance Computing News Analysis | insideHPC.