Intel Corporation today announced a detailed process and packaging technology roadmaps of “foundational innovations” for products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than 10 years, and PowerVia, a backside power delivery method, the company highlighted its planned adoption of next-generation extreme ultraviolet lithography (EUV), referred […]
Intel Releases Foundational Technology Roadmap, Launches New Naming Structure for Process Nodes
July 26, 2021 by
‘Intel Is Back’: Gelsinger Delivers Upbeat Update, Expanded Manufacturing in U.S., Europe
March 23, 2021 by
New Intel CEO Pat Gelsinger delivered an upbeat corporate update this afternoon in the form of a webinar that emphasized Intel’s integrated device manufacturing, “IDM.2.0” strategy for manufacturing and product development that combines the company’s internal network of factories with third-party outsourced capacity and new Intel foundries in the U.S. and Europe. “As I hope […]
Radio Free HPC – Big Changes at Intel: Gelsinger Takes the Helm
February 8, 2021 by
Our main topic today is Intel, with the bulk of the discussion surrounding the return of Pat Gelsinger as Intel’s new CEO. Pat was a 30-year veteran of Intel before he left to pursue other, well, pursuits – most notably as CEO of VMware. While at Intel, Pat spearheaded the development of the 486 architecture […]
