Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the complexity in heterogeneously integrated multi-chip(let) architectures, the companies announced. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI […]
Cadence and Intel Foundry Partner on EMIB Packaging for Heterogeneous Integration
February 21, 2024 by
HPC News Bytes 20240212: Honda Taps Cadence CFD HPC, Chip Industry Gyrations, Yelick in ISC Spotlight
February 12, 2024 by
Good day-after-Super-Bowl morning to you! It was an interesting week in HPC-AI last week, here’s a quick (5:47) run through some of the latest goings on: Honda taps Cadence supercomputer for air taxi R&D, chip industry gyrations, Kathy Yelick to deliver ISC 2024 keynote, Google settles patent infringement case….
Cadence Announces AI-Driven EDA Verification Platform
September 13, 2022 by
SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the Cadence Verisium AI-driven verification platform, a suite of applications leveraging big data and AI designed to optimize verification workloads, boost coverage and accelerate root cause analysis of bugs. The Verisium platform is built on the new Cadence Joint Enterprise Data and AI (JedAI) […]
Cadence to Acquire Data Center Digital Twins Company Future Facilities
July 12, 2022 by
SAN JOSE — Cadence Design Systems, Inc. announced today it has agreed to acquire Future Facilities, a provider of electronics cooling analysis and energy performance optimization solutions for data centers using physics-based 3D digital twins. Terms were not disclosed. “The addition of Future Facilities’ technologies and expertise supports the Cadence Intelligent System Design strategy and […]
