Overarching both themes is the slowing of Moore’s Law, the deceleration of improvement in HPC performance combined with increasing costs for new generations of systems. In addition, implementing and realizing the benefits of new systems is slowing ....

The post ISC 2024’s Wednesday Keynote: Two Trends Transforming HPC appeared first on High-Performance Computing News Analysis | insideHPC.

Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the complexity in heterogeneously integrated multi-chip(let) architectures, the companies announced. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI […]

The post Cadence and Intel Foundry Partner on EMIB Packaging for Heterogeneous Integration appeared first on High-Performance Computing News Analysis | insideHPC.

Along with his article to be found on this site, technology analyst Adrian Cockcroft of OrionX (and former AWS vice president) joins Shahin and Doug after SC23 to discuss TOP500 trends, the AI-HPC crossover, liquid cooling, chiplets, and the emergence of UCIe and CXL – some of the anticipated advancements are truly eye-popping. In this podcast, sponsored by Lenovo, the relentless pursuit of higher performance, the acceleration in the pace of change in high performance processing, is examined.

The post @HPCpodcast: Tech Analyst Adrian Cockcroft on Trends Driving Future HPC Architectures appeared first on High-Performance Computing News Analysis | insideHPC.

Santa Clara, Calif. – September 6, 2023 – Gerative AI chip startup d-Matrix has closed $110 million in a Series-B funding round led by Singapore-based global investment firm Temasek. The goal of the fundraise is to enable d-Matrix to begin commercializing Corsair, the world’s first Digital-In Memory Compute (DIMC), chiplet-based inference compute platform, after the […]

The post Gen AI Chip Startup d-Matrix Announces $110M in Series B Funding appeared first on High-Performance Computing News Analysis | insideHPC.

The post Avery Design Systems Announces Verification Support for New Chiplet Interconnect Standard appeared first on High-Performance Computing News Analysis | insideHPC.

A consortium of tech industry heavyweights today announced the Universal Chiplet Interconnect Express (UCIe) industry consortium with a mission to establish a die-to-die interconnect standard and foster an open chiplet ecosystem. Founding members include Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing […]

The post Heavyweight UCIe Consortium Launched to Standardize Chiplet Ecosystem appeared first on High-Performance Computing News Analysis | insideHPC.