[SPONSORED GUEST ARTICLE] Integration of optical I/O with an FPGA is the tip of the iceberg of a new vision to enable new HPC/AI architectural advances through ubiquitous optical interconnects for every piece of compute silicon. If you are attending SC23 November 12-17, be sure to visit Ayar Labs in booth #228 for an exclusive look at the future....

The post Optical I/O Takes Center Stage at SC23 appeared first on High-Performance Computing News Analysis | insideHPC.

At ISC 2023, we talked with AMD Product Manager Mahesh Balasubramanian, who with his usual enthusiasm updated us a host of items, including: New EPYC CPUs (including more than 300 performance records) and Instinct GPU AI accelerators (including information on the upcoming MI300A, recently revealed by CEO Lisa Su and due for launch later this […]

The post At ISC 2023: AMD Talks TOP500-GREEN500, the New EPYC 9004 CPU and MI300A GPU Accelerator and AMD’s Strides in HPC-AI appeared first on High-Performance Computing News Analysis | insideHPC.

[SPONSORED GUEST ARTICLE]  AI is everywhere, it’s in our homes, cars and jobs, it’s in our healthcare and our entertainment. The organizations we work for are increasingly AI-driven. Geopolitically, the combination of AI and supercomputing is central to national competitiveness and regional security. From a compute perspective, AI everywhere requires a variety of processors to […]

The post AMD’s Processor Portfolio and the ‘Pervasive AI’ Landscape appeared first on High-Performance Computing News Analysis | insideHPC.

PALO ALTO — Untether AI, an at-memory computation company for artificial intelligence (AI) workloads, today announced at the HOT CHIPS 2022 conference its next-generation architecture for accelerating AI inference workloads called speedAI devices, with an internal codename “Boqueria.” At 30 TeraFlops per watt (TFlops/W) and 2 PetaFlops of performance, the speedAI architecture sets a new […]

The post Untether AI Unveils At-Memory Compute Architecture at Hot Chips appeared first on High-Performance Computing News Analysis | insideHPC.

ANN ARBOR, Mich.—August 16, 2022 — Verge.io, with a mission to offer a simpler way to virtualize data centers, has added new features to its Verge-OS software designed to give users the performance of GPUs as virtualized, shared resources. The intent is to create a cost-effective, simple and flexible way to perform GPU-based machine learning, remote […]

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HSINCHU, Taiwan – Aug. 10, 2022 – Taiwan Semiconductor Manufacturing Company (TSMC: NYSE: TSM) today announced its net revenue for July 2022: On a consolidated basis, revenue for July 2022 was approximately NT$186.76 billion, an increase of 6.2 percent from June 2022 and an increase of 49.9 percent from July 2021. Revenue for January through […]

The post TSMC Reports 50% Y0Y Revenue Increase appeared first on High-Performance Computing News Analysis | insideHPC.

The post ALCF to Hold Cerebras AI Testbed Workshop, Aug. 9-10 appeared first on High-Performance Computing News Analysis | insideHPC.

Following recent reports that Dutch chip manufacturing equipment maker ASML is under diplomatic pressure from the U.S. to regulate the export of its fabrication equipment  to China, we discuss market data, other suppliers of fab equipment, and a quick view of some of ASML's own suppliers. ASML, the world's only maker of extreme ultraviolet lithography systems, does not export to China EUV equipment instrumental to making the world's most advanced chips used in HPC systems; it is the company's older equipment, DUV (deep ultraviolet lithography)  systems, that the US is trying to block from the China market.

The post @HPCpodcast: US Pressures ASML on Exports to China; US vs China Exascale; HPC Software appeared first on High-Performance Computing News Analysis | insideHPC.

Dutch semiconductor equipment maker ASML’s wunderkind chip manufacturing technology has become embroiled in the technology trade war between the United States and China, according to a Bloomberg story.  The U.S. is pressuring officials in The Netherlands to block ASML from selling older deep ultraviolet lithography (DUV) systems to China while also attempting to persuade Japan […]

The post Report: US Pressures Netherlands on Exports of ASML Chip Equipment to China appeared first on High-Performance Computing News Analysis | insideHPC.

The post TSMC Japan 3DIC R&D Center Completes Clean Room Construction in AIST Tsukuba Center appeared first on High-Performance Computing News Analysis | insideHPC.