Along with his article to be found on this site, technology analyst Adrian Cockcroft of OrionX (and former AWS vice president) joins Shahin and Doug after SC23 to discuss TOP500 trends, the AI-HPC crossover, liquid cooling, chiplets, and the emergence of UCIe and CXL – some of the anticipated advancements are truly eye-popping. In this podcast, sponsored by Lenovo, the relentless pursuit of higher performance, the acceleration in the pace of change in high performance processing, is examined.

The post @HPCpodcast: Tech Analyst Adrian Cockcroft on Trends Driving Future HPC Architectures appeared first on High-Performance Computing News Analysis | insideHPC.

By Adrian Cockcroft, Partner & Analyst, OrionX Last year the UCIe chiplet standard had just been launched, and since then just about everyone has joined it, about 130 companies. The idea is that to build a complete CPU or GPU you don’t have to put it all on the same chip from the same....

The post SC23: TOP500 Trends, the AI-HPC Crossover, Chiplet Standardization, the Emergence of UCIe and CXL Advancements appeared first on High-Performance Computing News Analysis | insideHPC.

In this edition of the HPC News Bytes podcast, Shahin takes us on a rapid (5:04) tour of SC23, analyzing the key developments and new technologies that highlighted last week’s conference in Denver: Conference attendance expands to 14,000; exascale update and future; raft of new chips, many focused on AI; Quantum Village at SC23; UCIe, PCIe and Ultra Ethernet

The post HPC News Bytes 20231120: SC23 Overview – Exascale Update, New AI Chips, Quantum Village, UCIe-PCIe-Ultra Ethernet appeared first on High-Performance Computing News Analysis | insideHPC.

[SPONSORED GUEST ARTICLE] Integration of optical I/O with an FPGA is the tip of the iceberg of a new vision to enable new HPC/AI architectural advances through ubiquitous optical interconnects for every piece of compute silicon. If you are attending SC23 November 12-17, be sure to visit Ayar Labs in booth #228 for an exclusive look at the future....

The post Optical I/O Takes Center Stage at SC23 appeared first on High-Performance Computing News Analysis | insideHPC.

[SPONSORED CONTENT]  “FLOPS are cheap, moving data is expensive.” In HPC circles this sentiment is heard often. There’s a growing sense that classical HPC systems and the advanced chips that power them are pushing up against their practical limits, that some foundational new technology is needed to build more balanced systems to achieve the next […]

The post Silicon Photonics and the Hunt for an HPC Bandwidth Bottleneck Breakthrough appeared first on High-Performance Computing News Analysis | insideHPC.

The post Avery Design Systems Announces Verification Support for New Chiplet Interconnect Standard appeared first on High-Performance Computing News Analysis | insideHPC.

A consortium of tech industry heavyweights today announced the Universal Chiplet Interconnect Express (UCIe) industry consortium with a mission to establish a die-to-die interconnect standard and foster an open chiplet ecosystem. Founding members include Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing […]

The post Heavyweight UCIe Consortium Launched to Standardize Chiplet Ecosystem appeared first on High-Performance Computing News Analysis | insideHPC.