Happy April Fool’s Day! It was as always an interesting week in the world of HPC-AI, this edition of HPC News Bytes includes commentary on: Microsoft and....

The post HPC News Bytes 20240401: A $100B AI Data Center, Eviden Says It’s Healthy, Alibaba’s RISC-V Chip, New Optical Interconnect Group, Nvidia Fights CUDA Translation appeared first on High-Performance Computing News Analysis | insideHPC.

SANTA CLARA, Calif.– Celestial AI, creator of the Photonic Fabric optical interconnect technology platform, announced it raised $175 million in its Series C funding round led by Thomas Tull’s U.S. Innovative Technology Fund (USIT). In addition to USIT, the round included participation from new and existing investors including AMD Ventures, Koch Disruptive Technologies (KDT), Temasek, […]

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BEAVERTON, OR. – August 2, 2023 – PCI-SIG today announced the formation of a workgroup to deliver PCI Express (PCIe) technology over optical connections. The PCI-SIG Optical Workgroup intends to be optical technology-agnostic, supporting a range of optical technologies, while potentially developing technology-specific form factors. “Optical connections will be an important advancement for PCIe architecture as they will […]

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Boston –– June 28, 2023 –– Photonic computing company Lightelligence has introduced Hummingbird, an optical network-on-chip (oNOC) processor designed for domain-specific AI workloads. Lightelligence said Hummingbird utilizes vertically stacked packaging technologies to integrate a photonic chip and an electronic chip into a single package serving as the communications network for data centers and other high-performance […]

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More than 20 companies have joined an industry consortium to establish specifications for multi-wavelength integrated optics – the emerging interconnect technology whose advocates say is critical to next-generation HPC and AI. Announced today, the CW-WDM MSA (Continuous-Wave Wavelength Division Multiplexing Multi-Source Agreement) Group, wants to build an ecosystem to work on common standards and interoperability for dense laser light sources, which in turn will enable broad adoption of optical I/O.

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Today Ayar Labs announced that the company has secured additional funding to fuel its growth as it drives to productize its TeraPHY optical I/O chiplets and SuperNova multi-wavelength lasers in 2019. The company aims to disrupt the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by driving a" 1000x improvement" in interconnect bandwidth density at 10x lower power.

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Ayar Labs is leveraging its recent Series A funding to bring optical interconnect silicon to the Cloud, HPC, and Telecommunication markets. "We’re seeing significant industry interest in optical chip-to-chip connectivity-- based on our assessments, the Total Addressable Market for inter-chip optical interconnect is 4x the optical transceiver market,” said Charlie Wuischpard, CEO of Ayar Labs."

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In this special guest feature from Scientific Computing World, Dr Keren Bergman, Professor of Electrical Engineering at the School of Engineering and Applied Science, Columbia University discusses her keynote on the development of silicon photonics for HPC ahead of her Tuesday keynote presentation at ISC 2018. "So today we are able to make all the components of photonic links and this includes 50 GHz data modulators, 50 GHz receivers, nanosecond scale switches all kinds of structures and we can do wave division multiplexing into these interconnect structures. The capabilities are just enormous."

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