SAN JOSE — August 30, 2022 — Edge machine learning company SiMa.ai today announced it has begun shipping what the company said is the industry’s first purpose-built software-centric machine learning system-on-chip platform for the embedded edge – the MLSoC. The $1 trillion global embedded edge market is currently reliant on legacy technology that limits the […]
@HPCpodcast: CXL News, the CHIPS Act, Chips and Nm and Chip ‘Sprawl’
August 19, 2022 by
We’ve heard so much about the CXL interconnect – including the recent announcement of CXL v3.0 – and components that are CXL-ready, that it may come as a surprise that CXL v1.1 “hosts” are only just now shipping. It’s a technology that could play a central role in the ever-more heterogenous, more memory-intensive systems of the future. And now, after several years of experimentation and various interconnect consortia, CXL is emerging as the standard for advanced functionality for fabric technologies. Along with CXL we also discuss some of the details of the CHIPS and Science Act….
Cadence Supports Intelligent SoC Development with On-Device Tensilica AI Platform
September 13, 2021 by
SAN JOSE, Calif., September 13, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today unveiled its Tensilica AI Platform for AI SoC development, including three supporting product families optimized for varying data and on-device AI requirements. Spanning the low, mid and high end, the platform delivers scalable and energy-efficient on-device to edge AI processing, which is key […]
