[SPONSORED CONTENT]   In automotive, first movers have a massive advantage. Success in the industry centers on vehicle R&D, at the core of which is design, performance and crash safety multi-physics software. Generating remarkably true-to-life simulations, these applications quicken vehicle time-to-market, allowing engineers to sample more design options and conduct more virtual tests in less time. […]

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Industry analyst firm Intersect360 has released partial results from an HPC end-user survey identifying the top user-rated processors, servers and cloud vendors. The key finding, according firm CEO Addison Snell: the disconnect between the HPC users, who want integration of Nvidia GPUs with CPUs from Intel or AMD, over against HPC vendors developing their own integrated solutions.

The post HPC End User Survey: Intel Xeon Still Dominates but AMD EPYC Gaining appeared first on High-Performance Computing News Analysis | insideHPC.

"HBM is a new type of CPU/GPU memory (“RAM”) that vertically stacks memory chips, like floors in a skyscraper. In doing so, it shortens your information commute. Those towers connect to the CPU or GPU through an ultra-fast interconnect called the “interposer.” Several stacks of HBM are plugged into the interposer alongside a CPU or GPU, and that assembled module connects to a circuit board. Though these HBM stacks are not physically integrated with the CPU or GPU, they are so closely and quickly connected via the interposer that HBM’s characteristics are nearly indistinguishable from on-chip integrated RAM."

The post Video: AMD’s next Generation GPU and High Bandwidth Memory Architecture appeared first on High-Performance Computing News Analysis | insideHPC.