TSMC announced it has signed a preliminary agreement with the U.S. Dept. of Commerce for up to $6.6 billion under the CHIPS and Science Act. TSMC also announced plans to build a third fab at its TSMC Arizona site in  Phoenix using 2nm or more processes....

The post TSMC in the USA: Up to $6.6B in CHIPS Act Funding for 3rd (2nm or More) Arizona Fab appeared first on High-Performance Computing News Analysis | insideHPC.

SAN JOSE, Feb 20, 2024 – Samsung Electronics Co., Ltd. today announced a collaboration to deliver Arm Cortex-X CPU developed on Samsung Foundry’s Gate-All-Around (GAA) process technology. This initiative is built on a partnership with devices shipped with Arm CPU intellectual property on various process nodes offered by Samsung Foundry. This collaboration will lead to […]

The post Samsung Collaborates with Arm on Cortex-X CPU appeared first on High-Performance Computing News Analysis | insideHPC.

IBM today unveiled what it said is the first chip with 2 nanometer (nm) nanosheet technology. Though still more than two years away from going into production, the company said the 2nm chip will be used to power devices ranging from cell phones to HPC-class data center servers and will deliver nearly 50 percent higher […]

The post 2 Seconds of Hair Growth: IBM Claims 1st 2 Nanometer Chip Technology appeared first on High-Performance Computing News Analysis | insideHPC.