BROMONT, QC, April 26, 2024 — IBM, the government of Canada and the government of Quebec today announced agreements to develop the assembly, testing and packaging (ATP) capabilities for semiconductor modules for telecommunications, high performance computing (HPC), automotive, aerospace and defence, computer networks and generative AI, at IBM Canada’s plant in Bromont, Quebec. The agreements reflect […]
TSMC Open R&D Center
July 28, 2023 by
HSINCHU, Taiwan, R.O.C., July 28, 2023 – TSMC (TWSE: 2330, NYSE: TSM) today held an opening ceremony for its global Research and Development Center in Hsinchu, Taiwan, which will develop next-generation TSMC semiconductor technology. The R&D Center will serve as the home for TSMC’s R&D Organization, including the researchers who will develop TSMC’s process technology at the […]
TSMC Reports Progress on 2nm Technology and 3nm Process at 2023 Technology Symposium
April 28, 2023 by
SANTA CLARA, CA, Apr. 26, 2023 – TSMC (TWSE: 2330, NYSE: TSM) showcased its latest technology developments at its 2023 North America Technology Symposium, including progress in 2nm technology and new members of its 3nm technology family. These include N3P, an enhanced 3nm process for better power, performance and density, N3X, a process tailored for […]
TSMC’s $40B US Investment: 4nm Fab Hitting Snags, 3nm Plant Construction Has Begun
December 5, 2022 by
(Editor’s Note: This story, originally published on Dec. 5, was updated on Dec. 6.) Pointing to high costs and a US skills shortage, Taiwanese chip manufacturer TSMC has reported challenges to the completion by next December of its new 4 nanometer semiconductor plant north of Phoenix, according to a story in The Wall Street Journal on Dec. 5. “The $12 billion Arizona semiconductor plant under construction that President Biden is visiting Tuesday represents U.S. hopes for a renaissance in manufacturing, but the Taiwanese company building it says it won’t be easy,” the Journal article stated. “High costs, lack of trained personnel and unexpected construction snags are among the issues cited by Taiwan Semiconductor Manufacturing Co. as it rushes to get the north Phoenix factory ready to start production in December 2023.”
IBM and Samsung Unveil ‘Semiconductor Breakthrough That Defies Conventional Design’
December 14, 2021 by
Today, IBM and Samsung Electronics jointly announced what they said is a breakthrough in semiconductor design utilizing a new transistor architecture that allows more transistors to be packed in an IC chip. The key: the transistors stand up rather than lie down, thus taking up less space and offering “a pathway to the continuation of […]
2 Seconds of Hair Growth: IBM Claims 1st 2 Nanometer Chip Technology
May 6, 2021 by
IBM today unveiled what it said is the first chip with 2 nanometer (nm) nanosheet technology. Though still more than two years away from going into production, the company said the 2nm chip will be used to power devices ranging from cell phones to HPC-class data center servers and will deliver nearly 50 percent higher […]
